The HeatFlux-Surface © codes

The code "HeatFlux-Surface" have been developed for the numerical simulation of the heat transfer into the multilayer targets impacted by the high energy fluxes of different character: by electron beams, which penetrate a target and release their energy volumetrically; as well as by a-particles or laser beams, which interact with a target surface only.

Together with the heat transfer processes into the solid phase of the target, the "HeatFlux-Surface" codes are able to simulate material evaporation from the target surface, melting and crystallization processes inside it.

The shielding phenomena by the vapor cloud, composed from the evaporated materials, resulting in reduction of the heat flux reached the solid surface as well as heat exchange in the cloud-solid system are simulated too in this model. The code "HeatFlux-Surface" admit a possibility for evaporation of the different material layers composed the target, partially or completely. In so doing, the properties of loaded surface are changed automatically as the facing material is evaporated completely.

Applications:
HeatFlux-Surface 2.0 - Fusion calculations. You can download this version here. This code is distributed free of charge.
HeatFlux-Surface 3.0 - Surface modification by electron beam, a-particles or laser beams. In present time we can perform calculations on your demand (info@alphysica.com). Version for download is in progress.

1) Heat load pulse start. Evaporation layer has not been formed. Outputted layer temperature is sample surface temperature.
2) End of heat load pulse. Sample temperature is maximal. Thickness of the evaporated layer is equaled to 2.4 mkm, evaporated layer temperature is maximal.
3) Sample cool down process (after loading pulse). Evaporated layer temperature goes down.
4) Cool down process of the sample and evaporated layer. Temperature distribution on the sample thickness is more uniform.
5) Next stage of the cool down process for the sample and evaporated layer. Temperature distribution on the sample thickness is more uniform than previous stage.
6) End of cool down process. Temperature distribution on the sample thickness is uniform.